Porting of Micro C/OS-II block daiagram of kernel in ARM powered microcontroller

CHAPTER 5

HARDWARE IMPLEMENTATION

The hardware modules of the project are

·         ARM

·         Temperature sensor

·         Graphical LCD

·         Max-232

·         Alarm

·         LED

Block Diagram

Fig 5.1: Block diagram

5.1 Block Diagram Description

 We have applied advanced real-time techniques software, that are intensively used in critical areas like space research and defense applications, to realize an industrial real time parameter Monitoring System. The heart of the system is a real-time kernel that uses preemptive scheduling to achieve multitasking on hardware platform. The Arm processor gets all relevant information from one source i.e. the remote terminal section. The temperature analysis data is plotted in convenient diagram in graphical LCD. The trend of all these parameters is available with a granularity of one minute.

In this project we are going to perform multitasking simultaneously. In Micro C/OS-II maximum number of task is 64, but here we going to perform up to 6 tasks the tasks like LED scrolling, alarm, temperatures sensor, graphical LCD, serial communication, relay are perform simultaneously.

RTOS for multitasking using arm controller is study paper, which can be adopted for various conditions, wherever the multi task operations are require with time constrain those are our project application area. For example missals launching, electronic engines, semaphore in ATM, nuclear plant, Robotics, boiler control in iron industries. In which we are take the temperature controlling operation in iron industry as our project

The following tasks are held by the controller while the operation:

Task-1:

Temperature sensor (i.e., ADC)

Task-2:

Graphical LCD (i.e., degree to graphical Fahrenheit)

 How the multitasking achieved in our project

Task-3:

UART (i.e., digital data displaying)

Task-4:

LED toggle (ie.,8-bit data flow control)

Task-5:

Buzzer (i.e., alarm device) 

5.2 Architecture of µC/OS-II

Board Support Package :( BSP)

     In embedded systems, a board support package (BSP) is implementation specific support code for a given (device motherboard) board that conforms to a given operating system. It is commonly built with a boot loader that contains the minimal device support to load the operating system and device drivers for all the devices on the board [1].

          Some suppliers also provide a root file system, a tool chain for making programs to run on the embedded system (which would be part of the architecture support package), and configurations for the devices (while running).

Fig 5.3: Board Support Package

 A board support package (BSP) is the common name for all board hardware-specific code. It typically consists of the following:

The boot loader

The OEM adaptation layer (OAL)

Board-specific device drivers

The BSP creation process involves the following tasks:

Developing a boot loader

Developing an OAL

Creating device drivers

Modifying run-time image configuration files